It seems that more evidence has been found regarding the possibility of a slimmer and lighter PlayStation 3.

This latest we've picked up comes from Furukawa Electric Co Ltd, which exhibited what it describes as the third generation in their line of heat sinks for Sony's console during Japan's Techno-Frontier 2008 last April 16 to 18.

The company explained that the first in their line of heat sinks was launched back in 2006, and was used to cool the 90nm chips that were equipped in the first-gen PS3s. As the Cell processor was cut down to 65nm later on, the heat sink design was also lightened and simplified.

The third-generation model lacks the copper heat pipes present in the earlier generations, and is only half the weight of the first build (from 700 to 350 grams). Even more interesting to note is that the new heat sink will be loaded separately on the PS3's CELL and RSX chips. Both chips were originally cooled by one large heat sink.

Does this hint at a possible Slim series for the PS3? It's hard to say at the moment, but at the very least, this drastically simplified heat sink could spell cheaper units in the near future. Drop by again in case we run into any more related updates. Those interested in reading the new heat sink's full tech specs can find more info via the source link below.